Architecture
3-Layer Mainboard Gives Total Freedom to the User
L0 – Power Management Layer (PML): Configure your own power setup with flexible DC/DC converters, turning 12 / 24 V DC into stable 3.3 V, 5 V, or any custom rail you need.
L1 – Controller Interface Module (CIM): Host your preferred microcontroller, SBC, or compute module to handle logic, communication, and system coordination.
L2 – I/O Peripherals Layer (IOP): Expand effortlessly with modular I/O boards, sensors, and actuators — each socket designed for reliable plug-and-play connectivity.
Smart I/O Boards — Modular Interfaces for Every Signal Type
Digital I/O (D*) — From simple direct lines to isolated, differential, or relay-based channels, digital modules cover everything from logic control to industrial switching.
Analog I/O (A*) — Precision measurement and output modules handle voltage, current, temperature, and low-level sensor signals with configurable ranges and isolation.
Communication I/O (C*) — Interface boards extend connectivity with RS-series, CAN, I²C, and other bidirectional transceivers, linking systems and external devices seamlessly.
Socket Compatibility — Smart Connections, Safe by Design
Tuxmio sockets are non-commutative, allowing flexible board pairing while preventing unsafe fits.
Four keyed socket types — GPP, AIP, URP, and ICP — cover general I/O, analog sensing, UART, and I²C communication.
All connectors use 2.54 mm keyed headers, ensuring perfect alignment, electrical safety, and foolproof modularity.
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